http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019151871-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_690cc554930dc1a055e2a067704963cc |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H1-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01H1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 |
| filingDate | 2018-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f84b54f465fa796279e89fdc80de834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_589ed400cd85c61d4073b10ef71e5f2f |
| publicationDate | 2019-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019151871-A |
| titleOfInvention | Plating material |
| abstract | Provided is a plating material in which an Au plating film is formed on an Ag plating film formed on a substrate and has a low friction coefficient and excellent wear resistance. In a plating material in which an Ag plating film is formed on a conductive base material made of copper or a copper alloy, and an Au plating film is formed on the Ag plating film, the Vickers hardness of the Ag plating film is 110 HV or more. The thickness of the Ag plating film is 0.5 to 10 μm, and the thickness of the Au plating film is 0.01 to 1 μm. [Selection figure] None |
| priorityDate | 2018-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.