| abstract |
An object of the present invention is to provide a curable resin composition that is excellent in adhesive strength, particularly adhesive strength to an organic film, and that realizes both flexibility and low moisture permeability. A resin composition containing component (A): a compound represented by the following formula (1), and component (B): a curable compound other than component (A). (In the formula (1), A represents an alkylene group having 0 to 5 carbon atoms. However, A does not exist when the carbon number is 0. B represents a hydrogen atom or a methyl group, and n represents an integer of 1 to 3. And m represents an integer of 1 to 20.) [Selection figure] None |