| abstract |
A curable material capable of effectively increasing the storage stability of a curable material and a connection structure using the same are provided. A curable material according to the present invention is a curable material containing a thermosetting compound and a thiol curing agent, and the acid value of the curable material is 27 mgKOH / g or more and 53 mgKOH / g or less. Furthermore, the curable material which can contain 55 to 90 weight% of electroconductive particle in 100 weight% of curable materials. [Selection] Figure 1 |