http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019127571-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L47-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2018-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07ce8406bdcd02128033126e32fc0d1a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_101de40077df716fcb65c138c7afcf3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_305251b27375c4ad4743f6902511dead |
| publicationDate | 2019-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019127571-A |
| titleOfInvention | Resin composition for insulating layer, sheet-like laminate material, multilayer printed wiring board and semiconductor device |
| abstract | The present invention provides an insulating layer resin composition having both excellent low thermal expansion properties, dielectric properties and smear removability, a sheet-like laminated material using the insulating layer resin composition, a multilayer printed wiring board, and a semiconductor device. . A resin composition for an insulating layer, which comprises (A) a compound having a polybutadiene skeleton, (B) an epoxy resin, (C) an active ester curing agent, and (D) an inorganic filler. The resin composition for an insulating layer, wherein the content of the (D) inorganic filler is 50 to 85 parts by mass with respect to 100 parts by mass on a solid basis of the resin composition for an insulating layer, and the resin for the insulating layer A sheet-like laminate material, a multilayer printed wiring board and a semiconductor device using the composition. 【Selection chart】 None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7298383-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023176314-A1 |
| priorityDate | 2018-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 133.