| abstract |
An object of the present invention is to provide a polyimide precursor solution capable of obtaining a molded product having at least one porous polyimide film having improved thermal conductivity while suppressing an increase in relative dielectric constant. A polyimide precursor solution containing an aqueous solvent containing water, resin particles not soluble in the aqueous solvent, inorganic particles, and a polyimide precursor. 【Selection chart】 None |