| abstract |
A curable composition capable of forming a stretchable resin layer having sufficient stretchability, high adhesion, and a high softening point, a stretchable resin layer, and a semiconductor device provided with the stretchable resin layer are provided. A curable composition for forming an elastic resin layer of the present invention comprises (A) an elastomer having a polystyrene chain and a polydiene chain, (B) a monofunctional linear alkyl (meth) acrylate, and (C) an alicyclic resin. It contains a monofunctional (meth) acrylate having a group, (D) a bifunctional or more compound having two or more ethylenic unsaturated groups, and (E) a polymerization initiator. [Selected figure] Figure 1 |