http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019123774-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2018-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55af40bbdfdcb5d1d314142ddf330765 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76f93278a5b655bdea69654a205ccb9b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81ac6b5cd2828362eee659894a0765c9 |
| publicationDate | 2019-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019123774-A |
| titleOfInvention | Semiconductor element protecting material and semiconductor device |
| abstract | To provide a material for protecting a semiconductor element capable of improving the insulation reliability under high temperature and high humidity of a cured product to be obtained and capable of favorably protecting the semiconductor element. The protective material is a semiconductor element protective material used to form a cured product on the surface of the semiconductor element by applying it on the surface of the semiconductor element to protect the semiconductor element. And a flexible epoxy compound, which is different from that which is disposed between the other members to be connected and which adheres and fixes the semiconductor element and the other members so as not to peel off. An epoxy compound different from the flexible epoxy compound, a curing agent which is liquid at 23 ° C., a curing accelerator, and an inorganic filler having a thermal conductivity of 10 W / m · K or more, Ra is, contains zinc oxide filler. [Selected figure] Figure 1 |
| priorityDate | 2018-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 160.