http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019116532-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3445 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 |
| filingDate | 2017-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab039f1b17326e260591260594dd566c |
| publicationDate | 2019-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019116532-A |
| titleOfInvention | Composition for sealing molding material and electronic component device |
| abstract | An object of the present invention is to obtain a cured product having high glass transition temperature (Tg), high thermal decomposition resistance and excellent formability, high voltage resistance, good adhesion to a semiconductor insert part and high reliability. Provided are a composition for a sealing molding material that can be used, and an electronic component device using the composition for a sealing molding material. SOLUTION: (A) maleimide resin having a specific structure, (B) nadiimide resin having a specific skeleton, (C) phenolic curing agent, (D) epoxy resin, (E) curing accelerator, (F) (F-1) A filler containing a hollow structure filler, The component (C) and the component (D) each contain a triphenylmethane skeleton and / or a naphthalene skeleton, and the component (E) is a (E-1) phosphorus-based curing accelerator, (E-2) imidazole-based The composition for sealing molding materials containing a hardening accelerator and (E-3) acid type hardening accelerator. 【Selection chart】 None |
| priorityDate | 2017-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 122.