http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019106492-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-35 |
| filingDate | 2017-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4d4cd6fee771a73b735ddd6f42e79e1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d69065268f312275a65d15a12675cc8 |
| publicationDate | 2019-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019106492-A |
| titleOfInvention | Film for sealing and film-coated electronic component mounting substrate for sealing |
| abstract | An object of the present invention is to provide excellent followability to irregularities generated due to the mounting of an electronic component provided in an electronic component mounting substrate, and to use this followability for a long time under severe conditions. There is also provided a sealing film capable of sealing an electronic component as well as a sealing film-coated electronic component mounting substrate provided with such a sealing film. A sealing film (100) is used to seal an electronic component mounting substrate (45), and the elongation at a softening point is 150% to 3500% before curing of a thermosetting resin, and the requirements are met. Satisfy A, B. A: When sticking on an epoxy substrate, after hardening a thermosetting resin, the adhesion rate of the film for sealing by the cross cut method will be 95% or more. B: When attached to an epoxy substrate, after the thermosetting resin is cured, the adhesion rate becomes 90% or more after storage under the conditions of temperature 85 ° C., humidity 85% RH, and time 240 hours. [Selected figure] Figure 2 |
| priorityDate | 2017-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.