| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ec83ea8e6721b1a5654b038fdb9b223f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67742 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68714
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6704
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67034
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B7-0014 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2017-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8db8a686f8ba663df0b117b048671b94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f0f45e2198a21cf2a95316908dbb3b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0879e0590e6c97a57a71b820b1370ad3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa763fca3296b1bb02893e72f7b8617f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0bd88238cb9e4757821e036d8a0dc5b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_229ff91a47110f02c680e08c99e429d7 |
| publicationDate |
2019-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019102698-A |
| titleOfInvention |
Substrate processing method and substrate processing apparatus |
| abstract |
The present invention provides a substrate processing method and a substrate processing apparatus capable of satisfactorily removing particles from the upper surface of a substrate and capable of satisfactorily drying the upper surface of the substrate. A particle holding layer is formed on the upper surface of a substrate by solidifying or curing a first treatment liquid on a substrate by heating (holding layer forming step). By supplying the peeling liquid (DIW, SC1 liquid) to the upper surface of the substrate, the particle holding layer is peeled and removed from the upper surface of the substrate (holding layer removing step). After removing the particle holding layer, a second processing liquid (IPA) is supplied to the upper surface of the substrate to form a liquid film of the second processing liquid covering the upper surface of the substrate (liquid film forming step). By heating the substrate, a gas phase layer holding the liquid film is formed between the upper surface of the substrate and the liquid film (gas phase layer forming step). By moving the liquid film on the gas phase layer, the second processing liquid constituting the liquid film is removed from the upper surface of the substrate (liquid film removal step). [Selected figure] Figure 4 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7301662-B2 |
| priorityDate |
2017-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |