| abstract |
An organic gap which is sufficiently soluble in an organic solvent usually used in spin coating, fills a gap without voids, does not outgas, and forms a stable cured film at a processing temperature exceeding 400 ° C. Provision of filling material. A semiconductor device substrate having a relief image having a plurality of gaps to be filled on a substrate surface, (i) one or more first monomers having two or more cyclopentadienone moieties, and an aroma A coating layer is provided, which comprises, as polymerized units, one or more second monomers having a group moiety and two or more alkynyl moieties as a polymerized unit, and (ii) one or more organic solvents. A method comprising: curing the coating layer to form a polyarylene film; patterning the polyarylene film; and transferring the pattern to a semiconductor device substrate. 【Selection chart】 None |