| abstract |
The present invention provides a resin composition exhibiting excellent physical property balance in electrical properties, heat resistance and thermal conductivity, and a prepreg using the same, a metal foil-clad laminate, a resin sheet, a printed wiring board and the like. A resin composition containing at least a cyanate ester compound (A) and a bismaleimide compound (B) represented by the following formula (I). [Chemical formula 1] (Wherein, R 1 to R 4 each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms.) 【Selection chart】 None |