http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019070192-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate | 2018-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57520725a52b3190fbc9cafd6aad4e50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64b9001d74dffb85dc50f6e99a69cd52 |
| publicationDate | 2019-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019070192-A |
| titleOfInvention | Stable electroless copper plating composition and method for electroless plating copper on a substrate |
| abstract | PROBLEM TO BE SOLVED: To stabilize an electroless copper bath over a wide concentration range without poisoning the catalyst and without affecting the plating rate or the plating performance even in the presence of high catalytic metal leaching and high MTO And providing an electroless copper plating bath that allows good through hole coverage and reduced ICD even at low plating temperatures. A source of one or more copper ions, a selected carboxymethyl-thio compound, one or more complexing agents, one or more reducing agents, and optionally one or more pH adjustments An electroless copper plating composition comprising: 【Selection chart】 None |
| priorityDate | 2017-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 127.