abstract |
An epoxy resin composition from which a cured product excellent in heat resistance and elastic modulus is obtained, and an epoxy resin cured product and composite material obtained using this epoxy resin composition are provided. An epoxy resin composition comprising an epoxy compound having a mesogen structure as an epoxy resin, and 3,3'-diaminodiphenyl sulfone and 4,4'-diaminodiphenyl sulfone as a curing agent. 【Selection chart】 None |