http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019061985-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf334efdc57a817d413aef1d9f5e9d80
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
filingDate 2017-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a1e002110c2829c634bb7a258582658
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39120aac3ea9325d55be69fb091a0496
publicationDate 2019-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2019061985-A
titleOfInvention Chip manufacturing method
abstract The present invention provides a chip manufacturing method capable of manufacturing a plurality of chips by dividing a plate-like workpiece without using an expanded sheet. A chip is irradiated with a laser beam only along a line to be divided such that a focusing point of a laser beam of a wavelength having transparency to a gallium nitride substrate is positioned at a first depth, Positioning a focusing point of a laser beam of a wavelength having transparency to the gallium nitride substrate at a second depth position, forming a first modified layer along a planned division line of the region; A second laser processing step of irradiating the laser beam along the planned dividing line to form a second modified layer in which the end portion overlaps the extra peripheral region, and applying a force to the gallium nitride substrate to form a gallium nitride substrate A dividing step of dividing into individual chips, and in the dividing step, a force is applied by heating and cooling to divide the gallium nitride substrate into individual chips. [Selected figure] Figure 6
priorityDate 2017-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 21.