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filingDate 2017-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2087f029fc8d535f778e8d1a056fa6c4
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publicationDate 2019-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2019061877-A
titleOfInvention Organic insulator, metal-clad laminate and wiring board
abstract To provide a wiring board having high adhesion strength of metal foil and high flame resistance. The flame retardant 7 is contained in a resin phase 5, and when the particle size distribution is evaluated by dividing the particle size of the flame retardant 7 into 1 μm, the number frequency of the range of 1 μm or less is maximum, Wiring substrate A in which phase 5 further includes inorganic particles 9 and the inorganic particles 9 divide the particle diameter into 0.5 μm portions to evaluate the particle size distribution, and the number frequency in the range of 0.5 μm or less is the largest. Wiring substrate in which the average particle size of the flame retardant 7 is larger than the average particle size of the inorganic particles 9, and the number frequency of each of the flame retardant 7 and the inorganic particles 9 decreases with the increase of the particle size. [Selected figure] Figure 1
priorityDate 2017-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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