| abstract |
A curable resin composition capable of obtaining sufficient resistance in a heat cycle test and / or a power cycle test, a sealing material using the curable resin composition, and a semiconductor device using the sealing material I will provide a. A resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, the following conditions: (II) from 23 ° C. by rheometer evaluation After the temperature is raised to 200 ° C. at 50 ° C./min, the lowest modulus when evaluated at a fixed temperature of 200 ° C. is 10 4 MPa or less, and the ultimate modulus 10 minutes after the start of temperature raising is 10 5 MPa or more. [Selection] Figure 1 |