http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019053281-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9abb3180fb91880a65477299e837ed4b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2018-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32d84deaf9d2e3ea07ae5f3cfa598555 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e94ff54b1c40f6e11a7a8b0fdcb82ac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2443b7ec2614acfecb35d2c5045c7bfd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b573c2a4c0e3288af82440e50e81fca http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24a3d7f1ebfb8e77cebad034bfe38361 |
| publicationDate | 2019-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019053281-A |
| titleOfInvention | Substrate with resist multilayer film and pattern forming method |
| abstract | PROBLEM TO BE SOLVED: To use a stripping solution which does not damage an organic resist underlayer film required in a semiconductor device substrate or a patterning process, for example, a hydrogen peroxide-containing aqueous ammonia solution called SC1 generally used in a semiconductor manufacturing process. Provided is a substrate with a resist multilayer film capable of easily wet-removing a silicon residue modified by dry etching. A substrate with a resist multilayer film having a substrate and a resist multilayer film formed on the substrate, wherein the resist multilayer film is an organic resist lower layer that is sparingly soluble in aqueous ammonia from the substrate side. A substrate with a resist multilayer film having a film, an organic film soluble in aqueous ammonia, a silicon-containing resist intermediate film, and a resist upper layer film in this order. [Selection diagram] None |
| priorityDate | 2017-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 313.