http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019046626-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4283a2f8ade5dc582d75300427a38e50 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-322 |
| filingDate | 2017-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f053b255334ff817c56dbd0b3a8bfd59 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_830ed41f6da69d5808790021b146b44a |
| publicationDate | 2019-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2019046626-A |
| titleOfInvention | Method of manufacturing circuit member |
| abstract | A method of manufacturing a circuit member using a metal nanoink and an ink containing a photocurable material in combination is provided. An uncured resin pattern is formed by applying an ink A containing a photocurable material and having a viscosity of 5 to 1000 mPa · s at 25 ° C on a substrate to form an uncured resin pattern and irradiating the uncured resin pattern with light. Forming a cured resin pattern, and applying an ink B containing metal nanoparticles and an organic solvent and having a viscosity of 1 to 1000 mPa · s at 25 ° C. on the substrate to form a metal pattern And a contact angle of the ink B to the cured resin pattern after 1 minute at 25.degree. C. after the ink B is applied to the surface of the cured resin pattern. The method of manufacturing a circuit member, which is 30 ° [Selected figure] Figure 1 |
| priorityDate | 2017-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 154.