http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019042829-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N35-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C65-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J19-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C3-00
filingDate 2017-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7337f5972322f75eaf8a49d29b2a058
publicationDate 2019-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2019042829-A
titleOfInvention Method of manufacturing microchannel chip
abstract An object of the present invention is to manufacture a microchannel by bonding a resin substrate and a resin film, so that bonding can be performed more reliably up to the edge portion of the channel groove. A bonding step of bonding a resin substrate (10) and a resin film (20) by thermocompression bonding with a heat press machine (6) is performed between the heat press machine (6) and the resin film (20). The first elastic sheet (30), the metal sheet (40), and the second elastic sheet (50) harder than the first elastic sheet (30) are disposed in this order from the side of the heat press (6) Do in the state. [Selected figure] Figure 2
priorityDate 2017-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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