| abstract |
A fiber-containing resin substrate that can suppress warpage of a substrate or wafer and exfoliation of a semiconductor element from the substrate, can be collectively sealed at the wafer level, and is excellent in storage stability of an uncured resin layer and handling property before curing. provide. A fiber-containing resin substrate 10 has a thermosetting epoxy resin-impregnated fiber base material 1 and an uncured resin layer 2 formed on one surface thereof, and the uncured resin layer has crystallinity. A type epoxy resin and / or bisphenol F type epoxy resin, epoxy resin that is non-flowable at 25 ° C. other than the above components, phenol compound having two or more phenolic hydroxyl groups in the molecule, inorganic filler, and urea system It is formed from the composition containing a hardening accelerator. [Selection] Figure 1 |