| abstract |
It is possible to prevent peeling of a sealing member from a heat radiating portion. In the semiconductor device 10, the difference in linear expansion coefficient between the sealing member 25 and the buried portion 33 of the sealed region B of the heat radiating portion 30 sealed by the sealing member 25 is within ± 25%. Therefore, occurrence of peeling of the sealing member 25 in the sealed region B of the heat radiating unit 30 is suppressed. Further, in the heat radiating portion 30, the flat plate portion 31 and the fin portion 32 are made of aluminum or an aluminum alloy, and the embedded portion 33 whose volume is smaller than that of the flat plate portion 31 and the fin portion 32 is made of copper or a copper alloy. Therefore, the weight reduction of the thermal radiation part 30 can be achieved. [Selection] Figure 1 |