| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4697
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-113 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-183
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2018-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_479000e3809b0c09d2df8194604121aa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3bcf3b9a1d7624c499e35fce14237ce3 |
| publicationDate |
2019-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019036740-A |
| titleOfInvention |
Electronic component storage package, multi-cavity wiring board, electronic device and electronic module |
| abstract |
An electronic component storage package in which the bonding strength between a connection conductor and a wiring board does not decrease is provided. An electronic component storage package includes an insulating substrate having a first main surface and a second main surface opposite to the first main surface, and a plurality of external parts provided on the second main surface. A connection conductor 108 and a connection conductor 109 provided from the outer peripheral end of the external connection conductor to the outer peripheral end of the insulating substrate are included. The connecting conductor is provided so that the distance from the second main surface in the thickness direction of the insulating substrate gradually increases from the outer peripheral end of the external connecting conductor to the outer peripheral end of the insulating substrate, and the insulator 110 is provided to cover the connecting conductor. In the thickness direction of the insulating substrate, the connection conductor exposed on the outer peripheral side surface of the insulating substrate is separated from the second main surface via the insulator. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020218335-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7128352-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020218335-A1 |
| priorityDate |
2016-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |