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filingDate 2017-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2019-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2019036651-A
titleOfInvention Semiconductor device and manufacturing method thereof
abstract A semiconductor device and a method for manufacturing the same that can suppress deterioration in characteristics and reliability of the semiconductor device without reducing productivity. A semiconductor substrate, an electrode layer disposed on the semiconductor substrate, a conductive member provided in an opening penetrating the semiconductor substrate and reaching the electrode layer, and electrically connected to the electrode layer; The conductive member includes a metal part, and a barrier metal part provided between the side surface of the opening and the metal part. The barrier metal part includes the first layer, the first layer, and the first metal layer. A second layer provided between the layer and the metal portion, the second layer being denser than the first layer. [Selection] Figure 1
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