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publicationDate 2019-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2019029460-A
titleOfInvention COMPOSITION FOR PACKAGE, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
abstract Provided is a package composition capable of reducing the dielectric constant of a sealing resin in a semiconductor package. A packaging composition according to one embodiment of the present invention contains a solid epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a pyrolytic foaming agent. The content of the pyrolytic foaming agent is 0.08% by mass or more and less than 0.5% by mass. [Selection] Figure 1
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