Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73e224665ceb7b15f8e66dfd0ee245c6 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-23 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-43 |
filingDate |
2017-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_833a56fdab90be637fd88d6603a3f3d6 |
publicationDate |
2019-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2019029460-A |
titleOfInvention |
COMPOSITION FOR PACKAGE, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE |
abstract |
Provided is a package composition capable of reducing the dielectric constant of a sealing resin in a semiconductor package. A packaging composition according to one embodiment of the present invention contains a solid epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a pyrolytic foaming agent. The content of the pyrolytic foaming agent is 0.08% by mass or more and less than 0.5% by mass. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11613618-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020179642-A1 |
priorityDate |
2017-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |