http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019026894-A

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filingDate 2017-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2019-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2019026894-A
titleOfInvention Electrolytic copper plating anode and electrolytic copper plating apparatus using the same
abstract Disclosed is an electrolytic copper plating anode capable of improving plating characteristics such as plating acceleration and via filling without complicating the device structure, and an electrolytic copper plating apparatus using the same. An anode disposed in an electrolytic treatment tank in which an electrolytic copper plating solution is stored, wherein the electrolytic copper plating solution is an acidic electrolytic copper plating solution containing a disulfide compound, and the anode is dissolved. An electrolytic copper plating anode characterized by comprising a conductive copper anode and an insoluble anode in an electrically connected state is employed. [Selection] Figure 1
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