| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 |
| filingDate |
2017-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42d3066de7e1b4894abb2aaa467a5d65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35c2df17a7d44e3ae206c06edb0a2d02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d5fad52ade4a8dd9b5ac65d3db3402b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e84e1e32480ebbc3fa771ca8105d6b23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fa8044b14cfb118dc6d15fef4f2144c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e5ac182e5207d27a16c980749c065df |
| publicationDate |
2019-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019026743-A |
| titleOfInvention |
Curable resin composition for forming flexible resin, resin film, and semiconductor device |
| abstract |
【Task】 To provide a curable resin composition for forming a flexible resin that is excellent in adhesiveness and insulation reliability with a conductive paste and has a small tack, and a resin film and a semiconductor device using the same. [Solution] (A) a styrenic elastomer partially modified with maleic anhydride, (B) a polymerizable compound and (C) a polymerization initiator, wherein (B) the polymerizable compound is (B1) (meth) acryloyloxy A curable resin composition for forming a flexible resin, comprising a silicone compound having a group. [Selection figure] None |
| priorityDate |
2017-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |