http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019024110-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f56b5174f7d196258707ccf1d609796e |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8234 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-088 |
filingDate | 2018-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9660c61eeb40f88401f62c18f9dcebd1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fa1bdc911d479bc4293f6e7428c38f3 |
publicationDate | 2019-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2019024110-A |
titleOfInvention | Semiconductor device and manufacturing method thereof |
abstract | A semiconductor device capable of providing a semiconductor device having a first recess with reduced number of steps, processing time, and manufacturing cost is provided. A semiconductor substrate SUB in which a first recess TI is formed on a main surface, a region on a side wall in the first recess TI, and a region extending along the main surface outside the first recess TI. The first insulation in which the first hole CH1A is formed in the first recess TI by being formed in the region on the side wall of the first recess TI and the second hole CH1A is formed in the region extending along the main surface. A film II1 and a first conductive layer CDL formed inside the first hole CH1A and the second hole CH1A are provided. The second hole CH1A communicates with the first hole CH1A. The first conductive layer CDL is in direct contact with the semiconductor substrate SUB at the bottom of the first hole CH1A. [Selection] Figure 4 |
priorityDate | 2018-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 73.