| abstract |
The present invention provides a resin as a material for an organic film forming composition having high embedding / planarization characteristics and etching resistance, the composition, and a pattern forming method using the composition. (I) A resin including a structure in which at least a part of a repeating unit includes a ring structure AR including an aromatic ring and a spiro structure SP bonded to four ARs alternately and (II) An organic film-forming composition containing an organic solvent. [Selection] Figure 1 |