http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019021716-A

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filingDate 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8719ce2bcc0051f156c349b5c0dab002
publicationDate 2019-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2019021716-A
titleOfInvention Method for manufacturing package substrate with sealing material layer and method for manufacturing hermetic package
abstract Provided is a method capable of effectively ensuring sealing strength at an interface between a package substrate and a sealing material layer while preventing thermal deterioration of internal elements. A method of manufacturing a package substrate with a sealing material layer according to the present invention includes a step of preparing a package substrate having a base portion and a frame portion provided on the base portion, kneading the sealing material and the vehicle, A step of producing a sealing material paste in which the resin amount is less than 0.6% by mass, a step of applying and drying the sealing material paste on the top of the frame portion of the package substrate, and producing a dry film; And irradiating the film with laser light to sinter the dried film to obtain a sealing material layer. [Selection] Figure 1
priorityDate 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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