| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f3518dca003902d9f332ad08ac9a6ffe |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C43-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B3-00 |
| filingDate |
2017-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc95d5881c9fe209741bbc33bf825649 |
| publicationDate |
2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2019014112-A |
| titleOfInvention |
Semiconductor device manufacturing method and mold |
| abstract |
A lens shape can be controlled with high accuracy. The mold includes an abutting portion that abuts against the substrate when the resin material on the substrate is molded into a predetermined shape, and the resin material is exposed to the outside in a state where the abutting portion is abutted against the substrate. A space for inflow and outflow is formed. The present technology can be applied to, for example, a mold that forms a lens resin portion of a solid-state imaging device. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7267589-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114571650-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-116674134-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114571650-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3928946-A4 |
| priorityDate |
2017-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |