| abstract |
The present invention provides a temporary adhesive that is excellent in adhesiveness, peelability and chemical resistance, suppresses peeling when using an organic solvent in an electronic component processing step, and can be peeled off after the processing step. A polyimide resin having at least a group represented by the formula (1), an epoxy resin having a specific structure of a siloxane having an epoxy group at both ends, a base thermosetting catalyst, and a siloxane polymer having a specific structure. Temporary adhesive. (N is an integer of 1 to 30; R 1 to R 4 are each independently a C1-15 alkyl group or a C6-10 aryl group) [Selection figure] None |