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filingDate 2015-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2018536080-A
titleOfInvention Copper electroplating bath containing compounds of reaction products of amines and quinones
abstract A polymer composed of a reaction product of an amine and a quinone. Quinone is a receptor for Michael addition. The polymer can be an additive to a copper electroplating bath. The polymer can function as a leveler and can enable the copper electroplating bath to provide copper deposits with high throwing power and reduced nodules.
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