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filingDate 2016-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2018532844-A
titleOfInvention Non-reactive hot melt adhesives containing specific resins
abstract The present invention is a non-reactive hot melt adhesive, which is 10 to 90% by weight of an amorphous thermoplastic resin calculated on the basis of the weight of the adhesive, and is compatible with polylactic acid. And an amorphous thermoplastic resin which is a random copolymer of another reactive monomer and 10-90% by weight of poly-L-lactic acid (PLLAU) and poly-D-lactic acid calculated based on the weight of the adhesive The present invention relates to a non-reactive hot melt adhesive comprising a polylactic acid polymer unit (PLAU) selected from (PDLAU) and a polylactic acid polymer unit (PLAU) having a number average molecular weight of 0.75 kg / mol or more. In one embodiment, the non-reactive hot melt adhesive is 0.5 to 20%, preferably 1 to 10% poly-L-lactic acid (PLLAU) calculated based on the weight of the first PLAU. ) And poly-D-lactic acid (PDLAU), which is a second polylactic acid polymer unit (PLAU) having a number average molecular weight of 0.75 kg / mol or more. When the first PLAU is a PLLAU, the second PLAU is a PDLAU, and when the first PLAU is a PDLAU, the second PLAU is a PLLAU. The non-reactive hot melt adhesive of the present invention has desirable properties. The adhesive has particularly good adhesion performance and good storage stability due to low low temperature fluidity and can have a short set time. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2022513303-A
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