http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018529841-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2016-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2018529841-A |
| titleOfInvention | Aqueous copper plating bath and method for depositing copper or copper alloy on substrate |
| abstract | The present invention relates to bisurea derivatives and the use of said derivatives in aqueous plating baths for depositing copper and copper alloys in the manufacture of printed circuit boards, IC substrates, semiconductors and glass devices for electronic applications. The plating bath according to the invention comprises at least one copper ion source and a bisurea derivative. This plating bath is particularly useful for filling the recess structure with copper and for building up the pillar bump structure. |
| priorityDate | 2015-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 124.