| abstract |
The present invention provides a compound of formula (I): ## STR1 ## wherein D is an x functional group; and x is an integer ≧ 2; provided that the x functional group D is from 15000 g / mol. Not a polycarbonate having an average molecular weight in the range of 150,000 g / mol], as well as thermosetting resin compositions based on polymaleimide resin systems containing such compounds as comonomers. The invention also relates to cross-linked resins that can be obtained by curing such compositions. The compounds of the invention can be used in particular in the fields of structural adhesives, matrix resins for fiber prepregs, molding compounds, and structural and / or electrical composite materials. |