| abstract |
Disclosed are a glass substrate assembly having low dielectric properties, an electronic assembly incorporating the glass substrate assembly, and a method of manufacturing the glass substrate assembly. In one embodiment, the substrate assembly includes a glass layer 110 having a first surface and a second surface, and a thickness of less than about 300 μm. The substrate assembly further includes a dielectric layer 120 disposed on at least one of the first surface or the second surface of the glass layer. The dielectric layer has a dielectric constant value less than about 3.0 in response to electromagnetic radiation having a frequency of 10 GHz. In some embodiments, the glass layer is annealed such that the glass layer has a dielectric constant value less than about 5.0 and a dissipation factor value less than about 0.003 in response to electromagnetic radiation having a frequency of 10 GHz. Made of open glass. The conductive layer 142 is disposed on the surface of the dielectric layer, in the dielectric layer, or below the dielectric layer. |