| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0158 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-065 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D213-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D211-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 |
| filingDate |
2016-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2018525770-A |
| titleOfInvention |
Preparation of highly conductive copper film |
| abstract |
The copper precursor composition comprises a first copper complex of an imine or a first cyclic amine coordinated to a cuprous precursor compound, and a second of a primary amine or a second cyclic amine coordinated to a second copper precursor compound. A copper complex. The copper precursor composition includes an imine copper complex coordinated to a copper precursor compound. The copper precursor composition is at a lower temperature than an equivalent composition comprising only a primary amine copper complex under the same different conditions for producing a metallic copper film having a resistivity of about 200 μΩ · cm or less. Pyrolysis is possible. The ink containing the copper precursor composition and the solvent can be deposited on a substrate and sintered to produce a metallic copper film. A substrate having the film thereon is useful for electronic devices. [Selection figure] None |
| priorityDate |
2015-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |