Predicate |
Object |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D413-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D241-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D265-33 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26 |
filingDate |
2015-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2018-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2018517793-A |
titleOfInvention |
Reaction product of bis anhydride and diamine as additive for electroplating bath |
abstract |
The reaction products of primary and secondary diamines and bis anhydrides are included as additives in the metal electroplating bath. Metal electroplating baths have good throwing power and deposit a metal layer having a substantially planar surface. Metal plating baths can be used to deposit metal on substrates having surface features such as through holes and vias. [Selection figure] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018513282-A |
priorityDate |
2015-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |