| abstract |
Provided is an electronic device housing comprising a thermoplastic composition. The thermoplastic composition includes at least one polycarbonate, at least two polysiloxane-polycarbonate copolymers, and a flame retardant. The thermoplastic composition may include additional polycarbonates, impact modifiers, one or more additives, or any combination of these components. A method for preparing the thermoplastic composition and an electronics housing are also provided. |