| abstract |
A method for attaching two substrates, in particular a first substrate A and a second substrate B, to each other by a latent reactive adhesive film having at least one latent reactive adhesive film layer, the latent reactive The adhesive film layer has a melting temperature T (melting) of 35 ° C. ≦ T (melting) ≦ 90 ° C. and includes a thermoplastic component containing a functional group capable of reacting with an isocyanate and dispersed in the thermoplastic component in the form of particles Present and blocked, microencapsulated or substantially deactivated in the region of the particle surface, the starting temperature T (starting) of the particles is 40 ° C. ≦ T (starting) ≦ 120 ° C. and an isocyanate-containing component that satisfies T (startup) ≧ T (melt), and the surface of the first substrate A is in contact with the first surface of the latent reactive adhesive film. Table of second substrate B In a method in which the application is caused by contacting the second surface of the latent reactive adhesive film and heating the latent reactive adhesive film to a temperature corresponding to or higher than at least the starting temperature T (starting), The surface of the first substrate A that contacts the latent reactive adhesive film is treated with a primer prior to contacting the first substrate A and the latent reactive adhesive film, and / or at least the latent reactive adhesive film. Wherein the first surface in contact with the first substrate A is treated with a primer prior to contacting the first substrate A with the latent reactive adhesive film. |