http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018501641-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0094 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate | 2015-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2018501641-A |
| titleOfInvention | Via bottom-up electrolytic plating method |
| abstract | Disclosed herein is a via bottom-up electroplating method in which a first carrier substrate (100) and a second substrate (110) having at least one through via (120) are temporarily interconnected. The method includes depositing a seed layer (108) on the surface of the first substrate, forming a surface modification layer (114) on the seed layer or on the second substrate, and surface modifying the second substrate. Joining the first substrate by the layer to form an assembly in which the seed layer and the surface modification layer are disposed between the first substrate and the second substrate, placing the conductive material (122) in the through via Removing a second substrate having a through via containing a conductive material from the assembly. |
| priorityDate | 2014-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.