http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018203839-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73e224665ceb7b15f8e66dfd0ee245c6 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2017-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_794a131d51a153afd82f7e4172cf8915 |
| publicationDate | 2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2018203839-A |
| titleOfInvention | Epoxy resin composition for sealing, method for manufacturing epoxy resin composition for sealing, and method for manufacturing semiconductor device |
| abstract | The present invention provides a sealing epoxy resin composition that can suppress unevenness in placement in a mold and generates less dust, a method for manufacturing a sealing epoxy resin composition, and a method for manufacturing a semiconductor device. . An epoxy resin composition for sealing, which is a particulate epoxy resin composition for sealing, and includes particles 210 that are cylindrical and have a smooth side surface 211 and a bottom surface 212 that is a crushing surface. The epoxy resin composition for sealing whose ratio of the particle | grains 210 with a particle size of 2 mm or more is 3 mass% or more. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020026818-A1 |
| priorityDate | 2017-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.