| abstract |
An epoxy resin composition and a semiconductor device excellent in low-temperature curability and workability, as well as adhesion and adhesion holding power are provided. The present invention provides the following components (A) to (C): (A) epoxy resin, (B) an aromatic amine-based curing agent, and (C) a curing accelerator, and the total amount in the (B) aromatic amine-based curing agent with respect to 1 equivalent of all the epoxy groups in the (A) epoxy resin. An epoxy resin composition, wherein the ratio of equivalents of amino groups is 0.7 to 1.5, and the (C) curing accelerator is an aryl borate salt, and a cured product of the epoxy resin composition A sealed semiconductor device is provided. [Selection figure] None |