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filingDate 2018-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_949501fab1aab8582f126f6a2d4786ac
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publicationDate 2018-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2018186282-A
titleOfInvention Semiconductor device
abstract In a bottom-gate transistor using an oxide semiconductor, when a high gate voltage is applied to a gate electrode layer, it may occur near the end of the drain electrode layer (and near the end of the source electrode layer). A structure in which certain electric field concentration is reduced, deterioration of switching characteristics is suppressed, and reliability is improved is provided. The insulating layer overlying the channel formation region has a tapered cross-sectional shape, and the thickness of the insulating layer overlying the channel formation region is 0.3 μm or less, preferably 5 nm or more and 0.1 μm. m or less. The taper angle θ at the lower end of the cross-sectional shape of the insulating layer overlapping the channel formation region is 6 It is 0 ° or less, preferably 45 ° or less, and more preferably 30 ° or less. [Selection] Figure 1
priorityDate 2011-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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