| abstract |
An object of the present invention is to prevent a decrease in reliability. In a semiconductor device (10), when a printed circuit board (13) is pressed to the bottom (11c) side of a case (11) through an adhesive (18), the back surface of the printed circuit board (13) is supported from projections 11e2, 11e4 formed on the bottom . Therefore, the gap between the printed circuit board 13 and the bottom portion 11 c is maintained at the height of the protrusions 11 e 2 and 11 e 4, and the adhesive 18 pressed by the printed circuit board 13 does not spread too much. As a result, at the both ends in the longitudinal direction of the printed circuit board 13, the end of the adhesive 18 is at the same position as the corresponding both ends of the printed board 13 or slightly protrudes outside the both ends. In the short direction of the printed board 13, the adhesive 18 protruding from both ends in the short direction of the printed board 13 is an adhesive 18 on the front surface of the printed board 13, the inner connection terminal 12 d 2, and the outer surface of the ceramic circuit board 15. I do not get into the side. [Selected figure] Figure 2 |