http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018181903-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf334efdc57a817d413aef1d9f5e9d80 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-308 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23D79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32136 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28D5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B27-06 |
| filingDate | 2017-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e98636a40e318806a99d2c95b48c019f |
| publicationDate | 2018-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2018181903-A |
| titleOfInvention | Processing method |
| abstract | An object of the present invention is to provide a processing method capable of increasing the processing speed while maintaining the processing quality when processing a plate-like workpiece formed by overlapping a metal-containing laminate on a line to cut. A processing method of processing a plate-like workpiece in which a laminate including metal is formed so as to overlap a line to be cut, and using the first holding table so that the laminate is exposed. A first holding step for holding, a cutting step for cutting a workpiece along a line to cut with a cutting blade to form a cutting groove for dividing a laminate, and a mask material provided in a region other than the line to be cut A second holding step of holding the workpiece on the second holding table so that the workpiece is exposed, and dry-etching the workpiece through the mask material to cut the workpiece along the line to be cut And an etching step, wherein the cutting step performs cutting while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece. [Selected figure] Figure 3 |
| priorityDate | 2017-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 149.