abstract |
【Task】 A photosensitive composition that provides a cured film excellent in transparency, heat resistance, chemical resistance, flatness, resolution, and chemical resistance without requiring a highly polar organic solvent, and formed by the photosensitive composition Provided is a cured film, and further an electronic component having the cured film. [Solution] Polyester amic acid (A), compound (B) having a polymerizable double bond, photopolymerization initiator (C), polymer (D) having an epoxy group having a weight average molecular weight of 3,000 to 50,000, A photosensitive composition comprising an epoxy compound (E) containing 2 to 10 epoxy groups per molecule and having a weight average molecular weight of less than 3,000, an epoxy curing agent (F), and a molecular weight modifier (G). [Selection figure] None |