http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018168366-A

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filingDate 2018-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_085fd38e00ce3427f8f97331d0c57fe7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_616f19fc0797f765447538db219542eb
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publicationDate 2018-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2018168366-A
titleOfInvention Polyamideimide solution and method for producing porous polyamideimide film
abstract PROBLEM TO BE SOLVED: To provide a PAI solution for forming a porous polyamideimide (PAI) film having a high porosity, fine pores and excellent moisture resistance, and a method for producing a porous PAI film using the PAI solution. [Solution] <1> A uniform PAI solution for forming a porous PAI film having the following characteristics. (1) PAI is a copolymerized PAI containing a dimer acid and / or dimer diamine component. (2) The solvent consists of a poor solvent and a good solvent for the PAI. <2> The PAI solution is applied onto a substrate to form a coating film, and then, when the solvent in the coating film is removed by drying, the action of the poor solvent remaining in the coating film is used. And causing the PAI on the base material to be porous by causing phase separation in the coating film. [Selection figure] None
priorityDate 2017-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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