| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2017-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4c992306bb798f81109c6a4add5ddd5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1db1670c8ef8428476b02faf64d87ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edc8c64e26f6ee47fe54705f4a9522b4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d641bf7def60ef5246c5ebc1bab268e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ac22d8c96b8a5ca3d788124b6ee57dd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44f8d5e6da6934a1fbfbe2241413b72b |
| publicationDate |
2018-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2018168336-A |
| titleOfInvention |
Conductive adhesive, cured product, electronic component and method for manufacturing electronic component |
| abstract |
A conductive adhesive capable of forming a connection structure having excellent voltage resistance and excellent conductive connection reliability, a cured product of the conductive adhesive, and the conductive adhesive. Provided are an electronic component including an electrically connected member, and a method of manufacturing an electronic component using the conductive adhesive. A conductive adhesive containing conductive particles that anisotropically conductively bonds members by thermocompression bonding, wherein a blending ratio of the conductive particles is 0.01 to 3.5% by volume in terms of solid content. The conductive adhesive is characterized in that the span value of the particle size distribution of the conductive particles represented by the following formula (1) is 3.0 or less. Span value = (D90−D10) / D50 (1) (In the formula (1), D50 is 0.1 to 20 μm) [Selection] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021161963-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021161964-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115380095-A |
| priorityDate |
2017-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |